Smt X Ray Inspection

Precision Insight for SMT Assemblies

Smt X Ray Inspection

The Dinghua X-Ray non-destructive testing instrument DH-X7 can be used in fields such as IC, BGA, CSP, semiconductors, SMT, DIP, lithium batteries, automotive parts, aluminum alloys, photovoltaics, molded plastics, and ceramics.

High-resolution X-ray imaging for internal PCB inspection
Accurate detection of hidden solder and component defects
Non-destructive analysis for multilayer and complex PCBs
Real-time imaging with advanced inspection software
Safe, fully shielded design for industrial use

Product Description Application Areas Technical Parameters & Specifications Detection & Measurement

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The X-ray source utilizes a sealed X-ray tube, featuring long service life and maintenance-free operation, with optional 90KV/110KV configurations.
The new-generation high-definition digital flat-panel detector, designed with high resolution, delivers optimal imaging in an extremely short time.
Laser auto-navigation positioning enables quick selection of imaging locations.
X/Y/Z-axis motion control ensures convenient and user-friendly operation.
CNC inspection mode supports rapid automated inspection for multi-point arrays.
Adjustable tilt angle up to 60° allows multi-angle inspection, making it easier to detect sample defects.
A visual high-definition navigation window provides intuitive operation and quick localization of inspection targets.
Stage size: 450mm * 500mm.
Simple and fast operation for rapid defect identification, with mastery achievable after just two hours of training.

1. X-ray inspection for electronic components, such as various package types, including TC/BCM/SFV/ceramic substrates;

2. Semiconductor/SMT/UIP electronic component inspection, X-ray machine for pcb;

3. X-ray inspection system can be used for lithium battery testing

4. Inspection of automotive parts/pressure casting components

5. Inspection for special industries (photovoltaics/molded plastics/ceramics, etc.)

	Overall	Machine Status
Dimension	1100 X 1200 X 2100mm	Power Supply	AC220V 10A
Weight	approx 1400KG	Gross weight	approx 1600KG
Packed size	1300 X 1400 X 2200mm	Power	1.7KW
Door opening	manual	Detection mode	offline
Feeding method	manual	Rights management	password

	X-ray	Tube
Light pipe type	closed	Phototube current	200uA
Light tube voltage	90KV	Focus size	3-5um
Cooling method	air cooling	Geometric magnification	300times

	Imaging	System
Detector	New TFT	Radiation tolerance	10000Gy
Effective imaging area	130 X 130mm	Protection level	IP65
Pixel matrix	1536 X 1536	Size	176 X 176 X 47
Pixel size	85µm	Weight	3.5KG
Spatial resolution	5.8lp/mm	Power	9W
Frame rate	20fps	Operative temperature	10-40°C
AD conversion digits	16bit	Storage temperature	-10-55°C
Data interface	Gigabit Ethernet	Operating humidity	20-90%HP (No condensation)
Trigger mode continuous	acquisition, pulse synchronization	Storage humidity	10-90% HP (no condensation)
X-ray energy range	40KV-90KV	Image Settings	Brightness, Contrast, Auto Gain and Exposure

	Industrial	Computer
Display	21.5-inch HD monitor	Operation system	Windows10 64bits
Operation method	keyboard/mouse	Hard drive/memory	1TB/8G

Bubble Rate Measurement

Automatic Calculation：Can measure bubbles of BGA and QFN packaged components, automatically calculate the bubble proportion in the selected area. You can set thresholds to automatically determine the void rate and maximum void rate.

Adjust Parameters：Adjust thresholds, size, Blob type, calculation parameters, etc. to get accurate results of automatic calculation.

Save Parameters：Users can save current bubble measurement parameters (thresholds, size, Blob type, calculation, etc.). These parameters can be directly reused when inspecting the same product next time, improving inspection efficiency.

Dimension Calculation

Filling Tin Ratio Calculation：Mainly used to measure the wetting rate of through-hole components. Obtain the proportion and height of the component’s soldering surface via rectangular frame selection.

Quick Measurement：Get the distance between two points via arbitrary frame selection.

Angle：Click points A and B to set the baseline, then click point C to measure the included angle between rays BA and BC.

Circle：Mainly used to measure tin balls and other circular components. Select any circular component via frame selection to get its circumference, area and radius.

Horizontal Rectangle：Mainly used to measure square components. Select a square via frame selection to get its length, width and area.

Automatic Inspection

CNC Inspection：For multiple inspection points, just set any position and measurement items; the software will automatically capture each inspection point and save the images.

Laser Positioning：Red dot laser positioning, double assistance, easy navigation.