New Easy-To-Operate

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New Easy-To-Operate WDS-620 BGA Rework Station

The New Easy-To-Operate WDS-620 BGA Rework Station is a high-performance solution designed for precise and efficient PCB repair and rework applications. Built with advanced temperature control technology, it ensures accurate heating and stable performance, making it ideal for handling delicate BGA, SMD, and other electronic components. Its user-friendly interface allows operators to work with ease, reducing errors and improving productivity. With reliable functionality, durable construction, and consistent results, the WDS-620 is perfect for electronics manufacturing, repair centers, and professional technicians seeking quality and efficiency in every task.

Easy-to-use control system for smooth operation
Precise temperature control for accurate rework
Suitable for BGA, SMD, and PCB repairs
Stable and reliable performance
Durable design for long-term use
Improves efficiency and reduces errors

Description Key Attributes

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Application of WDS-620 BGA rework station:

Laptop / Notebook/ Computer motherboard repair.
Playstation / XBOX 360 and other game console repair.
Iphone 4/ 4s / 5 / 5s motherboard repair.
TV / Video / ipad mainboard repair.
SMD/ SMT / IC BGA rework

WDS BGA rework station advanced features:

Top hot air flow is adjustable, to meet the demand of any chips.
Desoldering, mounting and soldering automatically.
Built-in infrared laser positioning, help fast positioning for PCB.
Top heating head and mounting head 2 in 1 design.
Mounting head with built-in pressure testing device, to protect the PCB from being crushed.
Build-in vacuum in mounting head pick up BGA chip automatically after desoldering completed.

WDS-620 automatic infrared BGA rework station parameter

1. Power Supply	AC 110V / 220V ±10% 50/60Hz
2. Total Power	Max 5300W
3. Heater Power	Upper Temp Zone: 1200W Second Temp Zone: 1200W IR Temp Zone: 2700W
4. Electrical Material	Driving Motor + PLC Smart Temperature Controller + Color Touch Screen
5. Temperature Controlling	High precision K-sensor (Closed Loop), independent temperature controller, accuracy up to ±1℃
6. Locating Way	V-shape slot, adjustable PCB support jigs, laser light for fast centering and positioning
7. PCB Size	Max: 500 × 380 mm Min: 10 × 10 mm
8. Applicable Chips	Max: 80 × 80 mm Min: 1 × 1 mm
9. Overall Dimension	L650 × W630 × H850 mm
10. Temperature Interface	1 pc
11. Weight of Machine	60 KG
12. Color	White & Blue

WDS-620 automatic infrared BGA rework station specifications:

Updated function

Newest WDS-620 is updated with 5 modes.It’s Remove,Mount,Weld,Manual and Semi-auto.The mode can be changed freely.

Independent 3 heating zones temperature control system

1.The upper and lower hot air heating,which can heat up at the same time from the top of he component to the bottom of the PCB;bottom IR heating,temperature precision control within ±1℃.8 segment temperature control independently.automatic BGA rework station

2.Hot air district heating for BGA and PCB at the same time,and large area IR heater preheating up for the bottom of PCB to avoid completely PCB deformation during reworking,the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element.

3.Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system;4 temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved;temperature can be tested precisely through external measurement interface,curves can be analysed,set and correct on the touch screen at any time.

Precision optical alignment system

1.Color optical system with functions of split vision, two color separation, zoom in/out and micro-adjust, equipped with aberration detection device, with auto focus and software operation.

2.CCD camera amplify up to 200x, with top/down light brightness adjust function, mounting accuracy is within 0.01 mm,and equipped with 15” high definition LCD monitor.

Multi-functional and humanized operation system

1.Adopting the HD touch human-machine interface;upper heating head and mounting head designed 2 in 1;providing many kinds of titanium alloy BGA tuyere can be rotated in 360 degree for easy installation and replacement.

2.X,Y and R angle adopted micrometer fine-tuning,accuracy locating,precision can reach ±0.01mm. computer motherboard repair machine

Superior safety protection function

With the alarm function, after the BGA welding the machine can alarm by itself.In the case of temperature abuse, the circuit can power off automatically with the double over-temperature protection.Temperature parameter having password protection to prevent any modification.mobile phone repairing machines

1.HD CCD Camera with optical lens

Automatically pick up and replace chips;
Built-in pressure testing device,can detect pressure of 0.8g.While the testing
device detect the pressure,the machine head will stop falling automatically to
protect PCB from being crushed;
Different sizes of vacuum sucker work for different sizes of chip.

♦ HD digital display
Effectively show condition of alignment of welding spot and IC chip

♦ Precise CCD optical alignment system

8 million pixels
Mounting accurancy within 0.01mm

2.High Sensitive MCGS Touch Screen

Multi storage 5000+ temperature profiles for different chip;
Display set and practical temperature;
English,Spanish,French and other languages are available.

3.Second Heating Zone Height Adjust Button & Heating Zone Adjust Switch&Laser Position

♦ Second heating zone height adjust
Distance between PCB and nozzles can be adjusted withi this rotary handel,suitable distance is 2-3mm
♦ Heating zone adjust
Can switch off the heating plate on both sides if the motherboard is small
♦ Laser position
Location the chip fast

4.Perfect design + Multi-functional button (Joystick,K-sensor,BGA Light Adjust)

♦ Joystick control
1.CCD lens zoom in/out
2.Up/down movement of machine head

♦ Micrometer
1.Slightly adjust angel of chip for precise alignment
2.Mounting accuracy within 0.01mm
3.Effectively increase success rate of repairing

♦ K-sensor

Test the temperature to get the accurate heating profile

Technical Specifications

Machine Type	Welding Manipulator
Voltage	110V / 220V
Current	Dependable
Type	Manual
Condition	New
Warranty	1 Year Free
Material	Metal
Rated Capacity	5300W
Max Input Power	100W
Brand Name	WDS BGA Rework Station
Dimensions	L650 × W630 × H850 mm
Place of Origin	Guangdong, China
Rated Duty Cycle	N/A
Usage	BGA Rework Station
Weight	60 kg
Product Name	WDS-620 Automatic BGA Rework Station
Operation Type	Stable and Precise
Machine Mode	Auto / Semi-Auto / Manual
PCB Size	Max: 500 × 380 mm, Min: 10 × 10 mm
Applicable Chip Size	Max: 80 × 80 mm, Min: 1 × 1 mm
Temperature Precision	±1°C
Replacement Accuracy	±0.01 mm
Alignment	CCD Alignment System with LCD
Heating	Infrared + Hot Air
Training	Free Operation & Maintenance Training