Perfect Solder, Proven Inside

X Ray Solder Joint Inspection

Supports non-destructive testing of electronic parts and internal soldering defects of PCBA circuit boards (such as short circuits, pores, cracks, and foreign matter), with a resolution of 1176×1104, which can clearly identify micron-level defects.

  • Clear internal inspection of solder joints and connections
  • Reliable detection of voids, bridges, and cracks
  • Non-destructive analysis for complex PCB assemblies
  • Improves solder quality and reduces rework