Perfect Solder, Proven Inside
X Ray Solder Joint Inspection
Supports non-destructive testing of electronic parts and internal soldering defects of PCBA circuit boards (such as short circuits, pores, cracks, and foreign matter), with a resolution of 1176×1104, which can clearly identify micron-level defects.
- Clear internal inspection of solder joints and connections
- Reliable detection of voids, bridges, and cracks
- Non-destructive analysis for complex PCB assemblies
- Improves solder quality and reduces rework










