PCB Fault Finder
SMT BGA X-Ray Inspection Machine WDS7000 for CSP BGA QFN LED Voids Detection With Chinese Xray Tube
The WDS7000 SMT BGA X-Ray Inspection Machine is designed for precise voids detection in CSP, BGA, QFN, and LED components, ensuring reliable non-destructive inspection of PCB assemblies. Equipped with a high-quality Chinese X-ray tube, it delivers stable imaging performance with strong penetration capability for clear internal defect visualization. The advanced system improves inspection efficiency by quickly identifying voids, cracks, and soldering issues with high accuracy.
- The WDS7000 SMT BGA X-Ray Inspection Machine ensures precise voids detection in CSP, BGA, QFN, and LED components.
- It provides reliable non-destructive testing for accurate internal PCB inspection.
- Equipped with a Chinese X-ray tube offering stable imaging and strong penetration capability.
- Advanced system detects voids, cracks, and solder defects with high speed and accuracy.
- Designed for SMT production lines ensuring continuous and consistent performance.
- Robust construction enhances product quality and supports efficient electronics manufacturing.
