The advanced HBS IR-X410 SMT/BGA Rework System takes the repair of the latest PCB assemblies in its stride, easily overcoming the frustrations and complexities of 'high end' rework. The system is tip/nozzle free, instantly and precisely controllable, clean and produces high quality BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs and Flipchips, and is ready for 0201 and lead-free applications. The IR-X410 comes with a good range of standard features allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It's hands-free, semi-automated and comes with HBS's user-friendly ThermoActiv V3 software suite.

• Ideal for the hidden interconnects in a high density environment
• Produces 100% yield BGA rework without any complications
• Instant, visible, highly controllable heating
• Tool free and gas free
• Modular and upgradeable

Advanced FIR Component Heating
Lens based FIR heating with adjustable image system
HBS lens attachments with IR image from 4 to 70mm diameter
Reworks all SMDs/BGAs including 0201s + lead free applications

 Large Area IR PCB Preheater System
Medium wave IR PCB preheating
1200W (2 x 600W switchable)
2 zones (inner - 120mm x 300mm) and (inner + outer - 240mm x 300mm area)

HBS Lens Attachments
F700 (25 -70mm spotsize) standard

Precision Pick-up System
Vacuum operated pick and place with precise macro-micro Z axis movement
Micrometer control for soft component landing
360° component rotation
Component nest and 'print frame' facility for paste application

Macro-Micro X/Y PCB Table
Precision micrometer (Micro) control
+/- 10 microns (.0004") movement in X/Y directions
Macro override facility in all directions
Up to 17" x 20" (420mm x 500mm) capacity with lockable XY axis

Non-Contact, IR Sensor for Measuring Component Temperature
Manually adjustable, K-type non-contact IR sensor
Realtime monitoring of component temperature throughout process

K-Type Contact Probe for Measuring PCB Temp.
Manually attached, K-type thermocouple contact probe
Realtime monitoring of PCB temperature throughout process

HBS ThermoActive V3 Software Suite
Type 5, Digital controller
Multi K-type thermocouple (x4) capacity for temp/time testing
Windows 98/me/XP/NT Thermo Active V3 software
Closed loop component/PCB temp. control
Drag and drop profile setting

HBS IR-X410 - Top of the range for BGA Rework
The advanced HBS IR-X410 SMT/BGA Rework System takes the repair of the latest PCB assemblies in its stride, easily overcoming the frustrations and complexities of 'high end' rework.

The system is tip/nozzle free, instantly and precisely controllable, clean and produces high quality BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs and Flipchips, and is ready for 0201 and lead-free applications.

The IR-X410 comes with a good range of standard features allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It's hands-free, semi-automated and comes with HBS's user-friendly ThermoActiv V3 software suite.

Ideal for the hidden interconnects in a high density environment
Produces 100% yield BGA rework without any complications
Instant, visible, highly controllable heating
Tool free and gas free
Modular and upgradeable

Topheat power: 150 watts IR

Backheater power: 600W or 1200 watts IR

Voltage/frequency: 110/240 volts 50/60Hz

Typical components: CSPs, BGAs, micro-BGAs, QFPs, PLCCs, SOICs, Small SMDs

Bench area required: 1400mm x 600mm

Weight: 65 Kg