XT5 PL - Large PCB, BGA Rework System
The PDR IR-XT5PL SMT/BGA rework system is specifically designed to be ultra-accurate and
deal with larger PCB assemblies
The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
The IR-XT5PL is well specified, but can be easily configured to your exact requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR's Focused IR technology, first introduced in 1987 and now used worldwide by over 3500 customers.
Focused
IR component heating
PDR's patented tool-free IR technology
Quartz IR PCB preheater
Large area (300mm x 240mm) 2000w system
Advanced Precision component pick and placement
Lift from Component nest, plus low force landing and rotation
Component nest/flux application system
Using Flux dip tray or component print frame
Precision X/Y/Theta PCB table
Macro-Micro movement and micrometer adjustment
Precision X/Y/Theta PCB table
Extendable with macro-micro movement and micrometer adjustment
Macro-Micro movement and micrometer adjustment
Auto-profile process
control package
With PDR's ThermoActive V4+ software suite
BGA/µBGA alignment
High Magnification, CCTV/prism based system
Auxiliary Process Camera
High Magnification, CCTV based system
Non-contact component
temperature sensing
Real time measurement of component temperatures
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