XT5 Advantage

Lower Cost, BGA Rework System

The PDR IR-XT5A SMT/BGA rework system is specifically designed to be lower cost but cope with the challenges of repairing today's PCB assemblies.

• Small - medium sized PCBs - SMDs, BGAs, uBGAs
• Software controlled, Focused IR process
• Lower cost, good mechanics

The system is keenly priced, tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.

The IR-XT5A can be easily configured to your requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR's Focused IR technology, first introduced in 1987 and now used worldwide by over 3500 customers..

Focused IR component heating
PDR's patented tool-free IR technology

Quartz IR PCB preheater
Large area (240mm x 240mm) 1600/2000w system

Advanced Precision component pick and placement
Lift from Component nest, plus low force landing and rotation

Component nest/flux application system
Using Flux dip tray or component print frame Precision X/Y/Theta PCB table
Macro-Micro movement and micrometer adjustment

Auto-profile process control package
With PDR's ThermoActive V4+ software suite

BGA/µBGA alignment
High Magnification, CCTV/prism based system

Auxiliary Process Camera
High Magnification, CCTV based system

Non-contact component temperature sensing
Real time measurement of component temperatures

Click here to Download.