XT3 M – Low Cost, Mobile Phone Rework System
The PDR IR-XT3M Mobile Phone rework system is specifically designed to be lower
cost but still cope with the challenges of repairing today's mobile phone and PDA assemblies
The system is keenly priced, tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
The IR-XT3M can be easily configured to your requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR's Focused IR technology, first introduced in 1987 and now used worldwide by over 3500 customers.
Focused
IR component heating
PDR's patented tool-free IR technology
Quartz IR PCB preheater
Confined
area (120mm x 120mm) 750w system
Precision component pick and placement
Precise placement plus low force landing and rotation
Precision X/Y PCB Workholder
Macro-Micro movement and micrometer adjustment
Auto-profile process
control package
With PDR's ThermoActive V4+ software suite
BGA/µBGA alignment
High Magnification, CCTV/prism based system
Auxiliary Process Camera
High Magnification, CCTV based system
Non-contact component
temperature sensing
Real time measurement of component temperatures
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